Enterprise-Grade DePIN Infrastructure
Modular, secure, and scalable hardware solutions for the decentralized physical network.
Live Architecture Demo
Live Hardware Oracle Stream
Real-time sensor data verification via W3-Core-Core
Verifying...
Current Hash
0x7f83b1657ff1fc53b92dc18148a1d65dfc2d4b1fa3d677284addd200126d9069
Signature SchemeECDSA secp256k1
Trusted EnclaveActive
Uptime99.999%
Patent: US-2024-99821-A1
W3-Core-Core Hardware Anchor
Heterogeneous dual-core architecture separating general-purpose computing from security operations.
- TrustZone-M Integration
- True Random Number Generator (TRNG)
- Hardware Abstraction Layer (HAL) for FreeRTOS
Third-Party Audit: Passed penetration testing by CertiK with zero critical vulnerabilities.
Technical Specificationsv2.4.0
| Process | 22nm |
| Crypto Engine | ECC/RSA/AES |
| Power | Ultra-low power deep sleep |
Architecture Diagram
Data Flow: Sensor → Secure Element → Chain
Patent: EP-3021-554-B1
Verifiable Data Protocol
End-to-end data integrity verification from sensor to blockchain.
- ECDSA (secp256k1) Hardware Signing
- Anti-Tamper Voltage Detection
- Secure Boot Chain
Third-Party Audit: Cryptographic implementation verified by SlowMist.
Technical Specificationsv2.4.0
| Signing Speed | <50ms |
| Verification | On-chain compatible |
| Protocol | MQTT/CoAP over TLS |
Architecture Diagram
Data Flow: Sensor → Secure Element → Chain
Patent: CN-11029384-A
Native Web3 Interoperability
Direct interaction with smart contracts via embedded hardware wallet functionality.
- Embedded EOA (Externally Owned Account)
- Multi-chain SDK (ETH, IoTeX, Polygon)
- Atomic Machine-to-Machine Payments
Third-Party Audit: Smart contract interfaces audited by OppenZeppelin.
Technical Specificationsv2.4.0
| Chains | EVM Compatible |
| Tx Format | EIP-1559 |
| State Sync | Light Client Mode |
Architecture Diagram
Data Flow: Sensor → Secure Element → Chain